Tag: micro-electro-mechanical systems

  • ST joins with OQmented on MEMS mirror-based solution

    ST joins with OQmented on MEMS mirror-based solution

    OQmented/STMicroelectronicsAgreement focuses on increasing development and capacity for ultra-compact, low-power laser-beam scanners to expand the market

    STMicroelectronics and OQmented, a startup focused on MEMS-mirror technology, have agreed to collaborate on the advancement of the technology for augmented reality and 3D-sensing markets. Micro-electro-mechanical systems (MEMS) combine tiny 3D mechanical structures and electrical circuits on a chip to sense and actuate activity.

    The joint effort aims to build on the expertise of both companies to advance the technology and products behind the leading MEMS-mirror-based laser-beam scanning solutions in the market.

    ST manufactures MEMS sensors, actuators and related components including drivers, controllers and laser-diode drivers. ST is contributing its MEMS design and manufacturing resources to the collaboration.

    OQmented plans to further industrialize and mass produce its Bubble MEMS technology, a patented 3D glass-encapsulation method of hermetic vacuum sealing of MEMS micro-mirrors. The glass bubbles eliminate environmental contaminants and minimize light-refraction effects.

    Automotive grade. Vacuum sealing is a key element for meeting automotive-grade requirements, while simultaneously reducing power consumption by an order of magnitude and enhancing performance for resonant, bi-axial scanners, where the MEMS mirrors move in both axes at their resonant frequency, creating an ultra-compact and power-efficient scanning solution. The resonant mirrors are suitable for display and 3D sensing applications in mobile devices.

    “In teaming with ST, we’ve chosen a solid semiconductor partner that has demonstrated its leading position in design and manufacturing of MEMS products, particularly MEMS mirrors, over the past 20 years,” said Ulrich Hofmann, CEO/CTO and co-founder, OQmented. “Combining ST’s expertise in developing, marketing, and manufacturing key components for laser-beam scanning solutions with OQmented’s knowledge and intellectual property will contribute greatly to our product offering, manufacturing capacity, and marketing channels, while also expanding the market in numerous application areas.”

    “Our goal in working with OQmented is to leverage our shared expertise and deep understanding of laser-beam scanning technologies with the mutual vision to continue the adoption and growth of laser-beam scanning in key applications, such as augmented reality and 3D sensing,” said Anton Hofmeister, vice president and general manager, MEMS Microactuator Division, STMicroelectronics.

    From the joint effort, ST and OQmented plan to market a wide range of scanning solutions. These would include MEMS mirrors, MEMS drivers and controllers, and complete reference designs of laser-beam scanning engines for a range of applications. The companies also intend to collaborate on a laser-beam scanning roadmap and the development of future technologies and products.

  • Murata offers new 6-degrees-of-freedom inertial sensor

    Murata offers new 6-degrees-of-freedom inertial sensor

    Photo: Murata
    Photo: Murata

    Murata has developed a new (micro-electro-mechanical systems (MEMS) six-degrees-of-freedom (6DoF) inertial sensor for GNSS positioning support, autonomous off-highway vehicles and dynamic inclination sensing. Murata’s new SCHA63T sensor is a single package 6DoF component. It can enable centimeter-level accuracy in machine dynamics and position sensing, and can assist in ensuring safe, robust and verified designs.

    The sensor enables further advancement in technology and novel solutions for GNSS-based measurement instruments, advanced driver/operator assistance systems, and autonomous vehicles.

    The product delivers highest performance available on the component level in the key parameters of bias stability and noise. Murata calibrates orthogonality of all measurement axes, which allows customers and system integrators to skip that critical process step.

    A key focus area in product development for SCHA63T has been to ensure operation during high mechanical shock and vibration. Within the same product family, sensor variants are qualified according to the automotive AEC-Q100 standard. The SHCA63T sensor includes advanced self-diagnostic features and can achieve full compliance with ASIL-D (Automotive Safety Integrity Level-D).

    The SCHA63T sensor features extensive failsafe functions and error bits for diagnostics. These include internal reference signal monitoring, checksum techniques for verifying communication, and signal saturation/over range detection.

    The diagnostic feature of Murata’s three-axis accelerometer is the continuously operating self-test function, which monitors the sensor during measurement. This patented self-test function verifies the proper operation of the entire signal chain, from MEMS sensor element movement to signal conditioning circuitry for every measurement cycle. Even if the system using SCHA63T is not required to follow international functional safety standards, the provided design support documentation enables for customers a cost effective, robust and fast design process.

    Murata, based in Japan, has more than 20 years of experience of providing inertial sensors for safety-critical automotive applications like electronic stability control.

  • HRL to develop inertial sensor tech for DARPA

    The Defense Advanced Research Projects Agency (DARPA) has awarded HRL Laboratories $4.3 million to develop vibration- and shock-tolerant inertial sensor technology that enables future system accuracy needs without utilizing GPS.

    While GPS provides sub-meter accuracy in optimal conditions, the signal is often lost or degraded due to natural interference or malicious jamming.

    HRL Laboratories, based in Malibu, California, is a corporate research-and-development laboratory owned by The Boeing Company and General Motors specializing in research into sensors and materials, information and systems sciences, applied electromagnetics and microelectronics.

    “The ATLAS project will deliver a comprehensive approach to breaking performance and cost, size, weight and power barriers in inertial sensor technology that prevent robust, GPS-independent, military positioning, navigation, and guidance,” said Logan Sorenson, principal investigator and research staff member in HRL’s Sensors and Materials Laboratory.

    ATLAS will combine intimate locking of a micro-electro-mechanical systems (MEMS) Coriolis Vibratory Gyroscope (CVG) sensor with an atomically-stable frequency reference in order to exploit the intrinsic accuracy of the atomic hyperfine transition frequency.

    “The engineering challenge lies in developing a system architecture to transfer the stability from the atomic reference to the CVG sensor without introducing unintended noise,” Sorenson said. “We are very excited to explore this novel approach to addressing long-standing precision navigation need faced by the U.S. military.”

  • PNT Roundup: Navigating GPS-free, MEMS inertial trends and non-GPS tracking

    Navigating GPS-free and MEMS inertial trends

     
    Keynotes at February’s Inertial Sensors conference summarize initiatives to provide continuous, high-frequency and high-accuracy position spanning GPS outages or obstructions.

    GPS-Free. Robert Lutwak, program manager at the U.S. Defense Advanced Research Projects Agency (DARPA), spoke on “Precise Robust Inertial Guidance for Munitions: Navigating in a GPS-free World.”

    Over the past decade, the DARPA Micro-Technology for Position, Navigation, and Timing (micro-PNT) program developed low-CSWaP inertial sensors as a backup or “flywheel” PNT solution for GNSS augmentation, validation and holdover in obfuscated environments. New programs, such as the Precise Robust Inertial Guidance for Munitions (PRIGM) program, seek to ruggedize and deploy devices developed under micro-PNT and to extend the performance to support longer and more dynamic mission scenarios. In addition to maturing micro-electro-mechanical systems (MEMS) and atomic technologies developed under micro-PNT, PRIGM is exploring new sensing modalities and architectures, including those enabled by integrated photonics and by the tight integration of photonic and MEMS technologies.

    Accuracy One-Thousandfold. Lutwak also gave an overview of DARPA’s new Atomic Clocks with Enhanced Stability (ACES) program. A technology challenge budgeted for up to $50 million, ACES’ goal is to design and build a new generation of palm-sized, battery-powered atomic clocks that perform up to 1,000 times better than the current generation — DARPA’s Chip-Scale Atomic Clock.

    The new clocks must fit into a package about the size of a billfold and run on a mere quarter-watt of power. Success will require advances that counter accuracy-eroding processes in current atomic clocks, among them variations in atomic frequencies that result from temperature fluctuations and subtle frequency differences that can occur if the power shuts down and then starts up again.

    “It will take a collaboration of teams with skill sets from diverse fields, including atomic physics, optics, photonics, microfabrication and vacuum technology, to achieve the unprecedented clock stability that we seek,” Lutwak said.

    MEMS Transition. Stephen Breit, director of engineering for Coventor, gave his predictions for the “Future of the Commodity MEMS Inertial Sensor Design and Manufacturing.”

    Emerging trends that could lead to disruptive changes include commoditization of MEMS process technology, consolidation of advanced semiconductor technology, More-than-Moore integration, and the Internet of Things (IoT). These trends motivate industry efforts toward a transition similar to the one that occurred in the CMOS industry: from integrated device manufacturers to a fabless/foundry business model.

    This will require a design automation flow that provides a platform for process design kits (PDKs) that foundries can supply to their fabless customers.

    Exploiting fingerprints, other smartphone features

     
    Tiny irregularities in an Android or iPhone’s accelerometer can be turned into a unique signature to track users, Stanford researchers found in 2013. These flaws essentially fingerprint an individual smartphone and allow it to be traced. Highly focused activity since then, some of it summarized here, has advanced the frontiers of non-GPS tracking. Developments could prove interesting to privacy advocates, online marketers and law enforcement.

    Security researcher Hristo Bojinov demonstrated how, in a matter of seconds, he induced his smartphone to give up its “fingerprints.” Code running on a website in the device’s mobile browser measured the tiniest defects in the device’s accelerometer, producing a unique set of numbers — exploitable to identify and track most smartphones. Marketers could use the ID the same way they use cookies to identify a particular user, monitor their online actions and target ads.

    The research team was also able to identify phones using their microphones and speakers. They found they could produce a unique frequency response curve, based on how devices play and record a common set of frequencies.

    Amplifiers and Oscillators. A team at the Technical University of Dresden developed a tracking method that exploits variations in the radio signal of cell phones. The collection of components such as power amplifiers, oscillators and signal mixers can all introduce radio-signal inaccuracies.
    Bojinov and colleagues presented further work at the RSA Conference 2015, in “Sensor ID: Mobile Device Identification via Sensor Fingerprinting.” Among findings:

    • We have found ways to construct a device ID by sensor fingerprinting.
    • All the sensors’ fingerprints may sum up to enough bits to identify all devices.
    • It is hardware dependent.
    • It can be used by web application.

    A related presentation stated that “this is only the beginning. Many more unexpected information leakages will be found in the coming years. Treat every app you install as having ‘root’ on the phone. And think twice before installing that ‘harmless’ game.”

    Engineers at Robert Bosch GmbH in Germany focused on MEMS-based gyroscopes and showed via wafer-level measurements and simulations that it is feasible to use the physical and electrical properties of these sensors for cryptographic key generation, a key requirement for full rollout of the Internet of Things.

    Teams from Virginia Tech and the University of Essex have published papers detailing similar approaches, basically turning this vulnerability into a tool. “We prove that device identification can be generated by using the accelerometer found in many pervasive devices,” wrote the Essex researchers. “Our experiments are based on a set of health sensors equipped with a MEMS accelerometer. Periodic readings are obtained from the sensor and analyzed mathematically and statistically to generate a stable ICMetric number.”

    Alissa Fitzgerald aided in assembling this overview report.