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Tag: ST Telemaco3P

  • STMicroelectronics and Virscient collaborate on connected-car systems

    STMicroelectronics and Virscient collaborate on connected-car systems

    STMicroelectronics (ST) and Virscient are collaborating to enable faster delivery of connected-car systems with ST’s Telemaco3P automotive application processors. Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP).

    STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. Virscient is a provider of hardware and software development services and support for customers building automotive solutions using ST’s Telemaco3P secure telematics and connectivity processors.

    Virscient’s connected-car systems rely on technologies such as GNSS (precise positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth and Bluetooth Low Energy.

    MTP is a comprehensive development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure and other vehicles, the companies said.

    The Telemaco3P incorporates Dual-Arm Cortex-A7 processors with an embedded hardware security module (HSM), an independent Arm Cortex-M3 subsystem, and a set of connectivity interfaces. With security at its core, and considerable flexibility in both hardware and software configurations, the Telemaco3P provides an excellent platform for connectivity within the vehicular environment.

    “We chose to collaborate with Virscient for Telemaco3P-based designs because of their differentiated expertise in the development of embedded systems and wireless technologies, and their proven track record of helping customers take connected products from concept to market,” said Philippe Prats, head of EMEA marketing and application for STMicroelectronics’ automotive and discrete products. “The Telemaco3P platform enables our customers to deliver new categories and products in automotive telematics. By working with Virscient, we make this exciting technology accessible to a broader range of innovative companies.”

    Commenting on the collaboration, Dr. Murray Pearson, CEO of Virscient, said, “We’re thrilled to work with STMicroelectronics to enable more companies to deliver innovative and market-leading platforms using the Telemaco3P devices.”

    “ST and Telemaco3P are setting the security standard for processor and connectivity solutions in vehicular telematics. By leveraging Virscient’s hardware and software development capabilities, and our considerable experience with embedded wireless and connectivity technologies, Telemaco3P customers can push the envelope, and get their products to market quicker than ever.”

    ST and Virscient are exhibiting the Modular Telematics Platform within the ST Automotive Telematics Ecosystem at Embedded World, ST stand (Hall 4A-138), Feb. 26-28, in Nuremberg, Germany.

  • Karamba Security joins with STMicroelectronics on cyber security

    Karamba Security, a provider of automotive cybersecurity, and STMicroelectronics (ST), a global semiconductor company, are integrating Karamba’s Carwall end-to-end protection on the ST Telemaco3P STA1385 Automotive Telematics and Connectivity Processor.

    Together, ST and Karamba are leveraging the security architecture of the Telemaco3P with the addition of Carwall Electronic Control Unit (ECU) hardening software.

    The combined solution provides cyber security features for both contents and run-time integrity verification by detecting attempts at modifications and preventing deviations from the ECU’s intended behavior, the companies said.

    Karamba Security’s deterministic approach has shown to prevent vehicle cyberattacks with zero false positives.

    “STMicroelectronics is a leading provider in the connected-car ecosystem,” said Ami Dotan, Karamba Security’s co-founder and CEO. “We are pleased to collaborate to protect automotive systems based on ST’s Telemaco3P microprocessor by automatically hardening them against cyberattacks to assure consumer safety.”

    “Karamba Security’s differentiated cyber-prevention solutions have generated significant market traction in a very short time and are a strong fit to enhance the security and value of ST’s Telemaco3P architectures,” said Antonio Radaelli, director of STMicroelectronics’ Infotainment, Automotive Digital Division. “Karamba’s Carwall adds another layer of security to the Telemaco3P benefits, which include its state-of-the-art power-efficient design, fast connectivity interfaces, domain isolation, and embedded Hardware Security Module. The combination provides customers with even stronger cybersecurity protection for in-vehicle systems.”

    For more information, visit STMicroelectronics’ booth at Electronica Munich on Nov. 13-16 in C3 Stand 101, where ST and Karamba will be available to discuss this joint security solution.